Core Capabilities
Beyond standard bonding services, we offer specialized solutions tailored to diverse material and design needs.
Hybrid Material Bonding
Expertise in joining dissimilar substrates—including GaAs-SiC, InP-Diamond, and LiNbO₃-Al₂O₃—without compromising structural integrity. Ideal for microfluidic devices requiring multi-functional layers.
Ultra-Thin Wafer Handling
Precision bonding for wafers thinner than conventional limits is critical for high-density semiconductor and MEMS applications—along with miniaturized microfluidic chips and high-density channel arrays used in point-of-care diagnostics.
Hermetic Sealing
Laser-driven glass-to-glass bonding that creates gas-tight seals of extremely small volume, ideal for implantable devices and microfluidic systems handling sensitive reagents, volatile fluids, or requiring long-term storage stability.
Wafer-Level Packaging
Simultaneous sealing of numerous devices per wafer. For microfluidics, this ensures uniform microchannel dimensions across batches—a key factor in reliable fluid flow.
Service Process
A professional engineer will contact you to confirm your actual requirements, conduct a feasibility assessment, test material compatibility, and verify your performance objectives.
First, conduct small-batch experiments to verify whether the bonding strength and process parameters can produce the products you desire, ensuring the parameters are accurate.
We will produce customized samples tailored to your needs, in the quantity you require. A comprehensive quality inspection report will be provided before the products are delivered to you.
We operate automated production lines with real-time quality monitoring. This enables efficient production while minimizing batch-to-batch variations that may arise from manual manufacturing, thereby enhancing product quality.
Our service doesn't end when you receive the products. We will continuously track the product usage and regularly optimize the application process accordingly.
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Client Testimonials
"Creative Biolabs helped us solve a recurring PDMS-to-glass delamination issue that had stalled our project for months. Their engineering support was timely, clear, and highly professional."
— R&D Director, Industrial Sensor Firm
"Turnaround time was fast and the quality control reports were thorough. Every bonded device passed pressure testing with consistent performance."
— Engineering Lead, Semiconductor Manufacturer
"What impressed us most was the optical clarity after bonding. The channels remained crisp under high-magnification imaging, which is crucial for our single-cell assays."
— Product Manager, Medical Tech Company
"Their hybrid material bonding solved our GaAs-SiC integration issue for optoelectronic modules. Communication was clear, and the final bonds met our durability needs. Reliable partner for microscale challenges."
— Emma Carter, Optoelectronics Engineering Manager
"We needed hermetic seals for tiny MEMS sensors, and their laser bonding delivered consistent, leak-free results. Post-delivery support helped optimize our production flow too. Very satisfied."
— Mark Torres, MEMS Device Development Lead
"Ultra-thin wafer handling was critical for our semiconductor project. Their team adjusted processes to fit our substrates, and prototypes arrived on time with accurate bonding. Great technical expertise."
— Lisa Wong, Semiconductor R&D Specialist
"Wafer-level packaging reduced our per-unit costs significantly. The yield was steady, and their quality checks caught minor issues early. A valuable partner for scaling our microcomponent production."
— Ryan Patel, Microengineering Production Manager
Published Data
Plasma-activated high-strength non-isothermal anodic bonding for efficient fabrication of the micro atomic vapor cells
In one study, a non-isothermal anodic bonding process based on plasma activation was developed to achieve high-strength bonding at low temperatures using the temperature gradient to keep the alkali metal away from the bonding interface. This procedure eliminates interference from the alkali metal and significantly increases the success rate of anodic bonding of vapor cells.
Fig.1 The bonding current and charge transferred during anodic bonding.1,3
An alternative micro-milling fabrication process for rapid and low-cost microfluidics
The conventional method for bonding PMMA to PMMA is using acetone and pressure to create a permanent seal. This successfully bonded the acrylic together, but once smaller microchannels are used, they often collapse during the bonding process, leaving the channel closed off, and rendering the microfluidic chip unusable. This prompted research into different kinds of solvents. In one study, they used a substrate soaked in ethanol and baked in the oven for 30 min, however, it still damaged microchannels. In another study, this method was modified and the solvent was only applied to the pocket; the chip was then enclosed, sandwiched between aluminium plates, and baked at 90 degrees Celsius for up to 12.5 min. This resulted in a bond strong enough to seal without damaging the microfluidic chip.
Fig.2 Solvent bonding.2,3
